With TEYAN's integrated process capabilities, we collaborate with clients to pioneer new processes.
Our modularly designed equipment provides flexibility to adapt to varied production requirements.
We provide one-to-one service from our application engineers, ensuring customer satisfaction and prompt responses
TEYAN's own semiconductor equipment is in mass production with top global IC manufacturers.
Custom Process Development
Adaptable Component Assistance
Reliable After-sales Service
Mass Production Proven
SiP & RFID production line with turn-key cooperation
Self-developed Equipment
The self-developed equipment of the company includes laser, plasma and sputter. The mechanical design, electrical design and software control system of the whole machine are all independently developed by the company, with independent intellectual property rights. The relevant equipment has reached the international technical level of similar equipment.
Laser Marking
Laser Cutting/Grooving
Laser De-flash
Laser Drilling（TSV/TMV）
Inline Plasma Clean
Wafer Plasma Clean（6/8/12）
Panel Plasma Etch
Inline Sputter
Batch Sputter
Cluster Sputter
Company Introduction
Shenzhen TEYAN Semiconductor Equipment Co., LTD. (TEYAN) was founded in 2017, mainly engaged in the Process & Equipment solution for the advanced package.
TEYAN self-developed equipment includes Laser series, Plasma series and Sputter series, which can be widely used in advanced package such as SiP, Fanout, Chiplet, 2.5D and 3D package. TEYAN equipment has reached the first-class level.
With rich experience in composite process, TEYAN can also provide the whole Project for SiP production line, which includes production line planning, process route formulation and equipment selection. Furthermore, TEYAN hopes to cooperate with our customers in the innovation of new process to provide better Process & Equipment service .
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