The TEYAN TMA-300 Auto Laser Marking Equipment is primarily applied to laser marking processes in the field of IC packaging. The TMA-300 mainly consists of automatic loading and unloading module, vision inspection module, marking positioning module, 2D code reading module, and cleaning dust removal module. Through quick and easy adjustments, this equipment can handle workpieces ranging from 50-100mm in width and 160-300mm in length, meeting the marking needs of semiconductor devices, lead frames, substrates, and tray units made from a range of materials including metal, plastic, ceramic, and glass.

The TEYAN TLF series ( Fiber Dual Heads Series) primarily meets the laser marking and cutting needs of the IC packaging field. The TLF series mainly consists of fiber laser combined with dual-output and optional beam-splitting input. The TLF series offers a flexible, efficient laser solution to SEMI client. It is applicable to a wide range of workpieces such as semiconductor devices, lead frames, substrates, tray units, etc., for laser marking and cutting processing.

The TEYAN CORONA-500W Auto Wafer Plasma Etching Equipment is primarily applied to wafer surface cleaning and pretreatment, compatible with 6‘’, 8‘’, and 12‘’wafers. The CORONA-500W mainly consists of wafer loading ports, dual-arm wafer robot, aligner, and vacuum plasma chamber module. It provides effective solutions for wafer cleaning and descum, enhancing adhesion, removing organic metal oxides, and wafer stress relief.

The TEYAN TPC-100 In-line Plasma Cleaning Equipment is primarily applied to surface treatment in the IC packaging field. The TPC-100 mainly consists of loading and unloading automation and vacuum plasma chamber module. It is applicable to cleaning processes prior to die-bonding and molding in IC packaging, clean of fluorine, organic and oxide contamination. It can effectively enhance adhesion and bonding strength, optimizing packaging yield.

The TEYAN SUPREME In-line Sputtering System is widely applied to SiP EMI shielding layer deposition, Fanout RDL seeding layer deposition, NPL( Non-Plating layer ) deposition, and BSM (wafer backside metallization) layer deposition, with high throughput and large-sized suitability. The SUPREME system mainly consists of loading/unloading chamber, plasma chamber, buffer chamber, and sputtering process chamber. It can provide different chamber designs according to various product application needs. Its deposition process guarantees a uniform film, outstanding pore/sidewall coverage, and superior adhesion, setting the standard in the industry.